Description
860 – Silicone Heat Transfer Compound
860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
| Features and Benefits |
|
| Catalog Number | Sizes Available | Packaging |
|---|---|---|
| 860-4G | 1.7 mL (0.06 fl oz) | Pouch a) |
| 860-60G | 25 mL (0.84 fl oz) | Jar |
| 860-150G | 62.5 mL (2.11 fl oz) | Tube |
| 860-1P | 470 mL (15.9 fl oz) | Jar |
a) Case pack of 100 pouches
