4865-454G Solder Sn63/Pb37 N.C. 0.81mm/0.032″ Dia. 21 Gauge


MG Chemicals, Lead Solder, Sn63/Pb37, No Clean, 0.81mm/0.032″ Dia. 21 Gauge

Out of stock

SKU: 4857867 Category:


4860-4867 – Sn63/Pb37 No Clean Solder Wire

The 4860–4867 Sn63/Pb37 No Clean Solder Wire is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

Features & Benefits

  • Eutectic alloy (liquidus = solidus temperature)
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive residue
  • Non-conductive residue
  • Halide free
Catalog Number Size Diameter Gauge Description
4860-18G 18 g (0.6 oz) 0.81 mm (0.032 in) 21 Pocket pack
4865-227G 227 g (0.5 lb) 0.81 mm (0.032 in) 21 Spool
4865-454G 454 g (1.0 lb) 0.81 mm (0.032 in) 21 Spool
4866-227G 227 g (0.5 lb) 1.01 mm (0.040 in) 19 Spool