Description
4870-4877 – Sn60/Pb40 No Clean Solder Wire
The 4870–4877 of Sn60/Pb40 No Clean Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and J-STD-006C specifications. It melts at a slightly higher temperature and over a wider range than the classical 63/37 solder. It results in robust and reliable joints that are highly resistant to whisker formation.
The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.
| Features |
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Spreads like rosin-activated flux
- Virtually non-splattering
- Non-corrosive residue
- Non-conductive residue
- Halide free
|
| Catalog Number |
Size |
Diameter |
Gauge |
Description |
| 4870-18G |
18g (0.6 oz) |
00.81 mm (0.032 in) |
21 |
Pocket pack |
| 4875-227G |
227 g (0.5 lb) |
00.81 mm (0.032 in) |
21 |
Spool |
| 4875-454G |
454 g (1.0 lb) |
00.81 mm (0.032 in) |
21 |
Spool |
| 4877-227G |
227 g (0.5 lb) |
1.27 mm (0.050 in) |
18 |
Spool |
