Description
4860-4867 – Sn63/Pb37 No Clean Solder Wire
The 4860–4867 Sn63/Pb37 No Clean Solder Wire is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.
| Features |
- Eutectic alloy (liquidus = solidus temperature)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Spreads like rosin-activated flux
- Virtually non-splattering
- Non-corrosive residue
- Non-conductive residue
- Halide free
|
| Catalog Number |
Size |
Diameter |
Gauge |
Description |
| 4860-18G |
18 g (0.6 oz) |
0.81 mm (0.032 in) |
21 |
Pocket pack |
| 4865-227G |
227 g (0.5 lb) |
0.81 mm (0.032 in) |
21 |
Spool |
| 4865-454G |
454 g (1.0 lb) |
0.81 mm (0.032 in) |
21 |
Spool |
| 4866-227G |
227 g (0.5 lb) |
1.01 mm (0.040 in) |
19 |
Spool |
