Description
4900P – SAC305 No Clean Solder Paste
Applications and Uses
4900P solder paste is designed to facilitate high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as to 0.3 mm.
Features & Benefits
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent printing characteristics
- Long stencil and tack life to facilitate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmospheres
- Medium soft, non-cracking residues
| Catalog Number | Sizes Available | Description |
|---|---|---|
| 4900P-25G | 25 g (0.88 oz) | Syringe |
| 4900P-250G | 250 g (8.81 oz) | Jar |
Storage and Shelf Life
Store refrigerated between 2–10°C [35–50°F] to minimize solvent evaporation, flux separation, and chemical activity. Storesyringes in an upright position with tip down to prevent flux separation and air entrapment.
Bring the paste to room temperature prior to use. To warm the refrigerated paste, let stand3 hoursat ambient temperaturebefore use. Forfaster warm up, place the sealed container in a water bath at ambient temperature for 30 minutes.
Unopened Container 2–10 °C[35–50°F] 24 months from date of manufacture.
Unopened Container 20–25 °C [68–77°F] 12 months from date of manufacture.
