4860P-35G Leaded Solder Paste No Clean Sn63/Pb37 35g Syringe (Keep Refrigerated)


Kept in refrigeration at HardCore’s store at 5°C – 7°C

MG Chemicals, No Clean Leaded Solder Paste, Sn63/Pb37, 35g Syringe, Type 3 (45-25 µm)

1 in stock

SKU: 4857857 Category:


4860P – Sn63/Pb37 No Clean Solder Paste

4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Applications and Uses

This solder paste is designed for use in high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Features & Benefits

  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Non-corrosive
  • Non-conductive residue
  • Halide free
  • Good wettability
  • Type 3 (45-25 µm)
Catalog Number Size Format
4860P-35G 35 g (1.23 oz) Syringe



Storage and Shelf Life

Store refrigerated between 2–10°C [35–50°F] to minimize solvent evaporation, flux separation, and chemical activity. Storesyringes in an upright position with tip down to prevent flux separation and air entrapment.

Bring the paste to room temperature prior to use. To warm the refrigerated paste, let stand3 hoursat ambient temperaturebefore use. Forfaster warm up, place the sealed container in a water bath at ambient temperature for 30 minutes.

Unopened Container 2–10 °C[35–50°F] 24 months from date of manufacture.
Unopened Container 20–25 °C [68–77°F] 12 months from date of manufacture.